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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    42-6575-18

    42-6575-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,515
    RFQ
    42-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    2676-9318-00-2401

    2676-9318-00-2401

    BGA SOCKET 1MM 676 POS 26X26

    3M

    2,328
    RFQ
    2676-9318-00-2401

    Datasheet

    - - Obsolete BGA - - - - - - - - - - - - - -
    7100186733

    7100186733

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    1,093
    RFQ
    7100186733

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    1027-2-0676-0B-00

    1027-2-0676-0B-00

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    1,483
    RFQ
    1027-2-0676-0B-00

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    400-PLS20001-12

    400-PLS20001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,138
    RFQ
    400-PLS20001-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    400-PRS20001-12

    400-PRS20001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,242
    RFQ
    400-PRS20001-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    1010-1-0100-0B-01

    1010-1-0100-0B-01

    TEXTOOL1010-1-0100-0B-01 PP4-661

    3M

    4,795
    RFQ
    1010-1-0100-0B-01

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    44-3574-18

    44-3574-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,251
    RFQ
    44-3574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6574-18

    44-6574-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    1,868
    RFQ
    44-6574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6575-18

    44-6575-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    3,588
    RFQ
    44-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    2257-6321-9UA-1902

    2257-6321-9UA-1902

    TEXTOOL 2257-6321-9UA-1902 PGA 2

    3M

    3,336
    RFQ
    2257-6321-9UA-1902

    Datasheet

    Textool™ Box Obsolete - - - - - - - - - - - - - - -
    48-6574-18

    48-6574-18

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    4,917
    RFQ
    48-6574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3575-18

    44-3575-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    1,577
    RFQ
    44-3575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3575-18

    48-3575-18

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    4,133
    RFQ
    48-3575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6575-18

    48-6575-18

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    2,935
    RFQ
    48-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    7100265152

    7100265152

    TEXTOOLTEST & BURN-IN SPGA SOCKE

    3M

    1,278
    RFQ
    7100265152

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    40-3575-18

    40-3575-18

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,584
    RFQ
    40-3575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6575-18

    40-6575-18

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    2,087
    RFQ
    40-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3553-18

    48-3553-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    3,684
    RFQ
    48-3553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    2200-6321-9UA-1902

    2200-6321-9UA-1902

    TEXTOOLTEST & BURN-IN PGA KIT SO

    3M

    3,158
    RFQ
    2200-6321-9UA-1902

    Datasheet

    Textool™ Bulk Active PGA, ZIF (ZIP) 200 (21 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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