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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    257-PLS20012-12

    257-PLS20012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,124
    RFQ
    257-PLS20012-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PLS20018-12

    257-PLS20018-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,192
    RFQ
    257-PLS20018-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS20012-12

    257-PRS20012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,588
    RFQ
    257-PRS20012-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100265145

    7100265145

    3M TEXTOOLTEST & BURN-IN BALL GR

    3M

    1,366
    RFQ
    7100265145

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    324-PLS18001-12

    324-PLS18001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,066
    RFQ
    324-PLS18001-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    324-PRS18001-12

    324-PRS18001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,233
    RFQ
    324-PRS18001-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    1027-2-0416-0B-00

    1027-2-0416-0B-00

    TEXTOOL1027-2-0416-0B-00 1.0MM O

    3M

    2,965
    RFQ
    1027-2-0416-0B-00

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    48-3551-18

    48-3551-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,129
    RFQ
    48-3551-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    48-3552-18

    48-3552-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,749
    RFQ
    48-3552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    48-6552-18

    48-6552-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,358
    RFQ
    48-6552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    48-6553-18

    48-6553-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,545
    RFQ
    48-6553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    48-3554-18

    48-3554-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,651
    RFQ
    48-3554-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    48-6554-18

    48-6554-18

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    4,620
    RFQ
    48-6554-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    7000090518

    7000090518

    TEXTOOLBURN-IN GRID ZIP SOCKETS

    3M

    2,148
    RFQ
    7000090518

    Datasheet

    Textool™ Bulk Active PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    1027-2-0516-0B-00

    1027-2-0516-0B-00

    TEXTOOL1027-2-0516-0B-00

    3M

    3,879
    RFQ
    1027-2-0516-0B-00

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    40-3551-18

    40-3551-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,951
    RFQ
    40-3551-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-3552-18

    40-3552-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,121
    RFQ
    40-3552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-3553-18

    40-3553-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    2,752
    RFQ
    40-3553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-6551-18

    40-6551-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,397
    RFQ
    40-6551-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-6552-18

    40-6552-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,731
    RFQ
    40-6552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
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