BomKey Electronics!
BomKey Electronics+852-69415941

IC Sockets

Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

Reset All
Apply All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
257-PLS20012-12

257-PLS20012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,124
RFQ
257-PLS20012-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PLS20018-12

257-PLS20018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,192
RFQ
257-PLS20018-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
257-PRS20012-12

257-PRS20012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,588
RFQ
257-PRS20012-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
7100265145

7100265145

3M TEXTOOLTEST & BURN-IN BALL GR

3M

1,366
RFQ
7100265145

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
324-PLS18001-12

324-PLS18001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,066
RFQ
324-PLS18001-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
324-PRS18001-12

324-PRS18001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,233
RFQ
324-PRS18001-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
1027-2-0416-0B-00

1027-2-0416-0B-00

TEXTOOL1027-2-0416-0B-00 1.0MM O

3M

2,965
RFQ
1027-2-0416-0B-00

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
48-3551-18

48-3551-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,129
RFQ
48-3551-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
48-3552-18

48-3552-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

4,749
RFQ
48-3552-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
48-6552-18

48-6552-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

4,358
RFQ
48-6552-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
48-6553-18

48-6553-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,545
RFQ
48-6553-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
48-3554-18

48-3554-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,651
RFQ
48-3554-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
48-6554-18

48-6554-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

4,620
RFQ
48-6554-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
7000090518

7000090518

TEXTOOLBURN-IN GRID ZIP SOCKETS

3M

2,148
RFQ
7000090518

Datasheet

Textool™ Bulk Active PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
1027-2-0516-0B-00

1027-2-0516-0B-00

TEXTOOL1027-2-0516-0B-00

3M

3,879
RFQ
1027-2-0516-0B-00

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
40-3551-18

40-3551-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3,951
RFQ
40-3551-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
40-3552-18

40-3552-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3,121
RFQ
40-3552-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
40-3553-18

40-3553-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2,752
RFQ
40-3553-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
40-6551-18

40-6551-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3,397
RFQ
40-6551-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
40-6552-18

40-6552-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3,731
RFQ
40-6552-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
Total 19086 Record«Prev1... 912913914915916917918919...955Next»
Contact Us Get more product information!
BomKey Electronics

Home

BomKey Electronics

Products

BomKey Electronics

Phone

BomKey Electronics

User

Low price every day, worry-free selection
Low price every day, worry-free selection
Genuine licensed goods, exquisite service
Genuine licensed goods, exquisite service
Multi-warehouse direct delivery, fast delivery
Multi-warehouse direct delivery, fast delivery
Complete range for easy shopping
Complete range for easy shopping
Copyright © 2025 Bomkey Electronics. All rights reserved