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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    40-6553-18

    40-6553-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,464
    RFQ
    40-6553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    7100265144

    7100265144

    TEXTOOLTEST AND BURN-IN BALL GRI

    3M

    1,126
    RFQ
    7100265144

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    361-PLS19001-12

    361-PLS19001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,240
    RFQ
    361-PLS19001-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7010293840

    7010293840

    TEXTOOL1021-2-0400-0B-00L36=1.0M

    3M

    2,824
    RFQ
    7010293840

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    200-6325-9UN-1900

    200-6325-9UN-1900

    CONN SOCKET PGA ZIF 625POS GOLD

    3M

    2,398
    RFQ
    200-6325-9UN-1900

    Datasheet

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    336-PLS20019-12

    336-PLS20019-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,521
    RFQ
    336-PLS20019-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    336-PLS20021-12

    336-PLS20021-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,411
    RFQ
    336-PLS20021-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    336-PRS20019-12

    336-PRS20019-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,494
    RFQ
    336-PRS20019-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    336-PRS20021-12

    336-PRS20021-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    1,236
    RFQ
    336-PRS20021-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    42-3551-18

    42-3551-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    4,698
    RFQ
    42-3551-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    42-3552-18

    42-3552-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,784
    RFQ
    42-3552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    42-3553-18

    42-3553-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    2,826
    RFQ
    42-3553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    42-6552-18

    42-6552-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    4,776
    RFQ
    42-6552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    36-3575-18

    36-3575-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,406
    RFQ
    36-3575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    336-PLS21022-12

    336-PLS21022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,701
    RFQ
    336-PLS21022-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100285425

    7100285425

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    3,289
    RFQ
    7100285425

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    7010297751

    7010297751

    TEXTOOL1019-1-0484-0B-02L25

    3M

    1,342
    RFQ
    7010297751

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    42-3574-18

    42-3574-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,843
    RFQ
    42-3574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3575-18

    42-3575-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,189
    RFQ
    42-3575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6574-18

    42-6574-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,416
    RFQ
    42-6574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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