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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    299-PRS20009-12

    299-PRS20009-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,164
    RFQ
    299-PRS20009-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    225-PRS15001-16

    225-PRS15001-16

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,520
    RFQ
    225-PRS15001-16

    Datasheet

    PRS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
    1023-2-0324-0B-01

    1023-2-0324-0B-01

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    1,108
    RFQ
    1023-2-0324-0B-01

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    256-5205-01

    256-5205-01

    3M TEXTOOL 256-5205-01 QFN .5 MM

    3M

    2,980
    RFQ
    256-5205-01

    Datasheet

    Textool™ Bulk Active - - - - - - - - - - - - - - -
    268-4204-00

    268-4204-00

    3M TEXTOOL 268-4204-00 QFN.4 MM

    3M

    2,578
    RFQ
    268-4204-00

    Datasheet

    Textool™ Bulk Active - - - - - - - - - - - - - - -
    216-PLS21016-12

    216-PLS21016-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,949
    RFQ
    216-PLS21016-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100236450

    7100236450

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    2,011
    RFQ
    7100236450

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    36-3574-18

    36-3574-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,208
    RFQ
    36-3574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-18

    36-6574-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    2,006
    RFQ
    36-6574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6575-18

    36-6575-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    4,409
    RFQ
    36-6575-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    336-PRS21022-12

    336-PRS21022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,025
    RFQ
    336-PRS21022-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PLS19012-12

    281-PLS19012-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,899
    RFQ
    281-PLS19012-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    240-PRS20014-12

    240-PRS20014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,420
    RFQ
    240-PRS20014-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-3574-18

    40-3574-18

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    4,405
    RFQ
    40-3574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6574-18

    40-6574-18

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    1,764
    RFQ
    40-6574-18

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    273-PRS21004-12

    273-PRS21004-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,608
    RFQ
    273-PRS21004-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    7100265147

    7100265147

    TEXTOOLBURN-IN GRID ZIP SOCKETS

    3M

    2,746
    RFQ
    7100265147

    Datasheet

    Textool™ Bulk Active PGA, ZIF (ZIP) 132 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    256-PRS20005-12

    256-PRS20005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,909
    RFQ
    256-PRS20005-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PLS20013-12

    257-PLS20013-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,307
    RFQ
    257-PLS20013-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS20013-12

    257-PRS20013-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,809
    RFQ
    257-PRS20013-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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