BomKey Electronics!
    BomKey Electronics+852-69415941

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

    Reset All
    Apply All
    Result
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-93-636-61-003000

    116-93-636-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,067
    RFQ
    116-93-636-61-003000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-328-61-801000

    110-43-328-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,534
    RFQ
    110-43-328-61-801000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    39-0508-21

    39-0508-21

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    4,471
    RFQ
    39-0508-21

    Datasheet

    508 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    39-0508-31

    39-0508-31

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    2,753
    RFQ
    39-0508-31

    Datasheet

    508 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    50-9508-20

    50-9508-20

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,353
    RFQ
    50-9508-20

    Datasheet

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    50-9508-30

    50-9508-30

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,504
    RFQ
    50-9508-30

    Datasheet

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-43-422-61-003000

    116-43-422-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,461
    RFQ
    116-43-422-61-003000

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-322-61-003000

    116-93-322-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,795
    RFQ
    116-93-322-61-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-628-G-B

    APA-628-G-B

    ADAPTER PLUG

    Samtec Inc.

    3,593
    RFQ
    APA-628-G-B

    Datasheet

    APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-628-G-B

    APO-628-G-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,581
    RFQ
    APO-628-G-B

    Datasheet

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-950-41-003000

    126-93-950-41-003000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    1,127
    RFQ
    126-93-950-41-003000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-950-41-003000

    126-43-950-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,890
    RFQ
    126-43-950-41-003000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-3553-11

    36-3553-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    4,069
    RFQ
    36-3553-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6551-11

    36-6551-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    4,676
    RFQ
    36-6551-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6552-11

    36-6552-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    2,172
    RFQ
    36-6552-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6553-11

    36-6553-11

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    3,834
    RFQ
    36-6553-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3552-11

    36-3552-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    3,653
    RFQ
    36-3552-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3554-11

    36-3554-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    1,764
    RFQ
    36-3554-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6554-11

    36-6554-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    4,863
    RFQ
    36-6554-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    122-13-632-41-801000

    122-13-632-41-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,024
    RFQ
    122-13-632-41-801000

    Datasheet

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 808809810811812813814815...955Next»
    Contact Us Get more product information!
    BomKey Electronics

    Home

    BomKey Electronics

    Products

    BomKey Electronics

    Phone

    BomKey Electronics

    User

    Low price every day, worry-free selection
    Low price every day, worry-free selection
    Genuine licensed goods, exquisite service
    Genuine licensed goods, exquisite service
    Multi-warehouse direct delivery, fast delivery
    Multi-warehouse direct delivery, fast delivery
    Complete range for easy shopping
    Complete range for easy shopping
    Copyright © 2025 Bomkey Electronics. All rights reserved