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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    111-93-650-61-001000

    111-93-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,685
    RFQ
    111-93-650-61-001000

    Datasheet

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-422-61-006000

    116-43-422-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,630
    RFQ
    116-43-422-61-006000

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-322-61-006000

    116-93-322-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,095
    RFQ
    116-93-322-61-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-318-61-003000

    116-43-318-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,585
    RFQ
    116-43-318-61-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-318-61-003000

    116-93-318-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,640
    RFQ
    116-93-318-61-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-652-61-001000

    110-41-652-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,445
    RFQ
    110-41-652-61-001000

    Datasheet

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-322-61-001000

    110-13-322-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,307
    RFQ
    110-13-322-61-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-422-61-001000

    110-13-422-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,198
    RFQ
    110-13-422-61-001000

    Datasheet

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0320-G-11

    HLS-0320-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,072
    RFQ
    HLS-0320-G-11

    Datasheet

    HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    324-13-132-41-002000

    324-13-132-41-002000

    SOCKET 4 LEVEL WRAPOST SIP 32POS

    Mill-Max Manufacturing Corp.

    3,766
    RFQ
    324-13-132-41-002000

    Datasheet

    324 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-11-648-41-001000

    123-11-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,613
    RFQ
    123-11-648-41-001000

    Datasheet

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-257-20-111117

    514-87-257-20-111117

    CONN SOCKET PGA 257POS GOLD

    Preci-Dip

    1,767
    RFQ
    514-87-257-20-111117

    Datasheet

    514 Bulk Active PGA 257 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-93-952-61-001000

    110-93-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,996
    RFQ
    110-93-952-61-001000

    Datasheet

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-81000-610C

    48-81000-610C

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,678
    RFQ
    48-81000-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    48-81250-610C

    48-81250-610C

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    1,406
    RFQ
    48-81250-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-43-952-41-004000

    612-43-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    1,997
    RFQ
    612-43-952-41-004000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-952-41-004000

    612-93-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,764
    RFQ
    612-93-952-41-004000

    Datasheet

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0817-TT-2

    HLS-0817-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,832
    RFQ
    HLS-0817-TT-2

    Datasheet

    HLS Bulk Active SIP 136 (8 x 17) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    111-43-328-61-001000

    111-43-328-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,867
    RFQ
    111-43-328-61-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-428-61-001000

    111-43-428-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,841
    RFQ
    111-43-428-61-001000

    Datasheet

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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