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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-93-328-61-003000

    115-93-328-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,506
    RFQ
    115-93-328-61-003000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-652-41-001000

    122-11-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,213
    RFQ
    122-11-652-41-001000

    Datasheet

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-964-31-018000

    614-93-964-31-018000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    2,547
    RFQ
    614-93-964-31-018000

    Datasheet

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-964-31-018000

    614-43-964-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,099
    RFQ
    614-43-964-31-018000

    Datasheet

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-324-61-001000

    111-43-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,855
    RFQ
    111-43-324-61-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-424-61-001000

    111-43-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,979
    RFQ
    111-43-424-61-001000

    Datasheet

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-624-61-001000

    111-43-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,330
    RFQ
    111-43-624-61-001000

    Datasheet

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-324-61-001000

    111-93-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,712
    RFQ
    111-93-324-61-001000

    Datasheet

    111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-424-61-001000

    111-93-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,570
    RFQ
    111-93-424-61-001000

    Datasheet

    111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-624-61-001000

    111-93-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,716
    RFQ
    111-93-624-61-001000

    Datasheet

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-264-41-001000

    714-93-264-41-001000

    SOCKET CARRIER DUAL INLINE 64POS

    Mill-Max Manufacturing Corp.

    1,872
    RFQ
    714-93-264-41-001000

    Datasheet

    714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0513-T-11

    HLS-0513-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,212
    RFQ
    HLS-0513-T-11

    Datasheet

    HLS Bulk Active SIP 65 (5 x 13) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-43-640-61-005000

    117-43-640-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,444
    RFQ
    117-43-640-61-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-640-61-005000

    117-93-640-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,585
    RFQ
    117-93-640-61-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-950-41-001000

    116-41-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,595
    RFQ
    116-41-950-41-001000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-950-41-001000

    116-91-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,218
    RFQ
    116-91-950-41-001000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-3508-212

    28-3508-212

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,305
    RFQ
    28-3508-212

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3508-312

    28-3508-312

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,872
    RFQ
    28-3508-312

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-316-61-003000

    116-43-316-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,445
    RFQ
    116-43-316-61-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-316-61-003000

    116-93-316-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,611
    RFQ
    116-93-316-61-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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