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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-93-964-31-002000

    614-93-964-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    1,023
    RFQ
    614-93-964-31-002000

    Datasheet

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    64-9503-20

    64-9503-20

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    3,469
    RFQ
    64-9503-20

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-43-314-61-007000

    116-43-314-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,277
    RFQ
    116-43-314-61-007000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-314-61-007000

    116-93-314-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,978
    RFQ
    116-93-314-61-007000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-318-61-105000

    110-93-318-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,057
    RFQ
    110-93-318-61-105000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-964-31-007000

    614-93-964-31-007000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    4,354
    RFQ
    614-93-964-31-007000

    Datasheet

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-964-31-007000

    614-43-964-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,599
    RFQ
    614-43-964-31-007000

    Datasheet

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-3552-11

    40-3552-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    2,932
    RFQ
    40-3552-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3553-11

    40-3553-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    1,864
    RFQ
    40-3553-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6551-11

    40-6551-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,527
    RFQ
    40-6551-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6552-11

    40-6552-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    3,041
    RFQ
    40-6552-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6553-11

    40-6553-11

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,624
    RFQ
    40-6553-11

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    115-43-650-61-001000

    115-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,997
    RFQ
    115-43-650-61-001000

    Datasheet

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-650-41-004000

    612-43-650-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,113
    RFQ
    612-43-650-41-004000

    Datasheet

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-650-41-004000

    612-93-650-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,575
    RFQ
    612-93-650-41-004000

    Datasheet

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6574-11

    24-6574-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,535
    RFQ
    24-6574-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3571-11

    24-3571-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,954
    RFQ
    24-3571-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3572-11

    24-3572-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    4,163
    RFQ
    24-3572-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3573-11

    24-3573-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,954
    RFQ
    24-3573-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3574-11

    24-3574-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    1,283
    RFQ
    24-3574-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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