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Heat Sinks

Manufacturer Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
625-35AB

625-35AB

HEATSINK FOR 25MM BGA

Wakefield-Vette

348
RFQ
625-35AB

Datasheet

625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.350" (8.89mm) - 13.10°C/W @ 200 LFM - Aluminum Black Anodized
657-10ABPE

657-10ABPE

HEATSINK TO-220 W/PINS BLK 1"

Wakefield-Vette

807
RFQ
657-10ABPE

Datasheet

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 41°C 3.70°C/W @ 200 LFM - Aluminum Black Anodized
288-1ABE

288-1ABE

HEATSINK FOR TO220

Wakefield-Vette

3,312
RFQ
288-1ABE

Datasheet

288 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.215" (5.46mm) 4.0W @ 85°C 12.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
HSB32-232318

HSB32-232318

HEAT SINK, BGA, 23 X 23 X 18 MM,

Same Sky (Formerly CUI Devices)

615
RFQ
HSB32-232318

Datasheet

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) 5.9W @ 75°C 4.40°C/W @ 200 LFM 12.67°C/W Aluminum Alloy Black Anodized
628-25AB

628-25AB

HEATSINK FOR 45MM BGA

Wakefield-Vette

2,991
RFQ
628-25AB

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
624-35AB

624-35AB

HEATSINK FOR 21MM BGA

Wakefield-Vette

5,444
RFQ
624-35AB

Datasheet

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.350" (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum Black Anodized
HSB33-272710

HSB33-272710

HEAT SINK, BGA, 27 X 27 X 10 MM,

Same Sky (Formerly CUI Devices)

1,044
RFQ
HSB33-272710

Datasheet

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) 4.4W @ 75°C 5.30°C/W @ 200 LFM 17.22°C/W Aluminum Alloy Black Anodized
657-20ABPNE

657-20ABPNE

HEATSINK TO-220 W/PINS BLK 2"

Wakefield-Vette

1,000
RFQ
657-20ABPNE

Datasheet

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM - Aluminum Black Anodized
659-65AB

659-65AB

HEATSINK EXTRUSION 37MM

Wakefield-Vette

759
RFQ
659-65AB

Datasheet

659 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450" (36.83mm) 1.450" (36.83mm) - 0.650" (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum Black Anodized
624-60AB

624-60AB

HEATSINK FOR 21MM BGA

Wakefield-Vette

521
RFQ
624-60AB

Datasheet

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.600" (15.24mm) - 1.00°C/W @ 400 LFM - Aluminum Black Anodized
625-60AB

625-60AB

HEATSINK FOR 25MM BGA

Wakefield-Vette

329
RFQ
625-60AB

Datasheet

625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.600" (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum Black Anodized
628-35AB

628-35AB

HEATSINK FOR 45MM BGA

Wakefield-Vette

1,997
RFQ
628-35AB

Datasheet

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.350" (8.89mm) 3.0W @ 50°C 10.00°C/W @ 150 LFM - Aluminum Black Anodized
ATS-PCBT1086

ATS-PCBT1086

HEATSINK TO-220 W/TAB BLACK

Advanced Thermal Solutions Inc.

989
RFQ
ATS-PCBT1086

Datasheet

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) - 9.50°C/W @ 200 LFM 22.00°C/W Aluminum Black Anodized
627-15ABPE

627-15ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

410
RFQ
627-15ABPE

Datasheet

627 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 1.500" (38.10mm) 6.0W @ 65°C 5.50°C/W @ 200 LFM - Aluminum Black Anodized
626-20ABPE

626-20ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

186
RFQ
626-20ABPE

Datasheet

626 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 2.000" (50.80mm) 6.0W @ 55°C 4.70°C/W @ 200 LFM - Aluminum Black Anodized
657-25ABPNE

657-25ABPNE

HEATSINK TO-220 W/PINS BLK 2.5"

Wakefield-Vette

970
RFQ
657-25ABPNE

Datasheet

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.500" (63.50mm) 6.0W @ 25°C 2.70°C/W @ 200 LFM - Aluminum Black Anodized
655-26AB

655-26AB

HEATSINK FOR 40MM BGA

Wakefield-Vette

3,946
RFQ
655-26AB

Datasheet

655 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) - 0.260" (6.60mm) 5.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum Black Anodized
677-10ABPE

677-10ABPE

HEATSINK

Wakefield-Vette

1,988
RFQ
677-10ABPE

Datasheet

677 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 3.10°C/W @ 200 LFM - Aluminum Black Anodized
HSB41-303014P

HSB41-303014P

HEAT SINK, BGA, 30 X 30 X 10 MM,

Same Sky (Formerly CUI Devices)

410
RFQ
HSB41-303014P

Datasheet

HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.551" (14.00mm) 5.9W @ 75°C 4.30°C/W @ 200 LFM 12.63°C/W Aluminum Alloy Black Anodized
HSB39-252509P

HSB39-252509P

HEAT SINK, BGA, 25 X 25 X 9 MM,

Same Sky (Formerly CUI Devices)

341
RFQ
HSB39-252509P

Datasheet

HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.354" (9.00mm) 4.3W @ 75°C 6.30°C/W @ 200 LFM 17.53°C/W Aluminum Alloy Black Anodized
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