BomKey Electronics - Subscriber Identification Module (SIM) Cards - RF and Wireless - page 4 - Original source of goods - BomKey Electronics_Electronic Components Procurement Network

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Format	Class	Memory	Core Processor	Carrier Network	Network Technology	Features	Operating Temperature	Size / Dimension
NL-SIM-ATT MICRO-SIM 3FF ATT COMM TEMP NimbeLink, LLC	1,268	-	RFQ	Datasheet	-	Bulk	Obsolete	3FF (Micro)	-	-	-	AT&T	-	-	-25°C ~ 85°C	33.6mm L x 29mm W x 6.63mm H
NL-SIM-TMO MICRO-SIM 3FF T-MOBILE COMM TEMP NimbeLink, LLC	2,511	-	RFQ	Datasheet	-	Bulk	Obsolete	3FF (Micro)	-	-	-	T Mobile	-	-	-25°C ~ 85°C	33.6mm L x 29mm W x 6.63mm H
NL-SIM-SPR MICRO-SIM 3FF SPRINT COMM TEMP NimbeLink, LLC	3,751	-	RFQ	Datasheet	-	Bulk	Obsolete	3FF (Micro)	-	-	-	Sprint	4G	-	-25°C ~ 85°C	15mm L x 12mm W x 0.86mm H
SIM-ST-MFF2 GLOBAL IOT EMBEDDED SIM CHIP Hologram, Inc.	2,222	-	RFQ	Datasheet	-	Tape & Reel (TR)	Discontinued at Digi-Key	ESIM (MFF2)	-	-	-	-	2G, 3G, 4G LTE IOT	-	-	5mm L x 6mm W x 0.82mm H
SIM-N2-2FF3FF4FF GLOBAL IOT SIM 2FF/3FF/4FF Hologram, Inc.	2,857	-	RFQ	Datasheet	-	Box	Obsolete	2FF (Mini), 3FF (Micro), 4FF (Nano)	-	-	-	-	2G, 3G, 4G LTE IOT	-	-	5mm L x 6mm W x 0.82mm H
NL-SIM-TMO-CTRI MICRO-SIM 2FF 3FF 4FF T-MOB COMM NimbeLink, LLC	2,621	-	RFQ	Datasheet	-	Bulk	Obsolete	2FF (Mini), 3FF (Micro), 4FF (Nano)	-	-	-	T Mobile	-	-	-25°C ~ 85°C	33.6mm L x 29mm W x 6.63mm H
GL1 EUICC TRIPLE CUT SIM Hologram, Inc.	3,533	-	RFQ	Datasheet	-	Bulk	Discontinued at Digi-Key	2FF (Mini)	-	-	-	-	2G	-	-25°C ~ 85°C	5mm L x 6mm W x 0.75mm H
GL1-MFF2-2500 EUICC MFF2 SIM WITH GLOBAL SIM P Hologram, Inc.	4,804	-	RFQ	Datasheet	-	Tape & Reel (TR)	Discontinued at Digi-Key	ESIM (MFF2)	-	-	-	-	2G	-	-25°C ~ 85°C	5mm L x 6mm W x 0.75mm H

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