BomKey Electronics - Socket Adapters - Sockets for ICs, Transistors - page 5 - Original source of goods - BomKey Electronics_Electronic Components Procurement Network

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Convert From (Adapter End)	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
44-505-110 SOCKET ADAPTER PLCC TO 44PGA Aries Electronics	3,286	-	RFQ	Datasheet	Correct-A-Chip® 505	Bulk	Active	PLCC	PGA	44	0.050" (1.27mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
1107254-32 SOCKET ADAPTER DIP TO 32DIP 0.3 Aries Electronics	4,680	-	RFQ	Datasheet	Correct-A-Chip® 1107254	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	32	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
48-655000-10 SOCKET ADAPTER TSOP TO 48DIP 0.6 Aries Electronics	4,544	-	RFQ	Datasheet	Correct-A-Chip® 655000	Bulk	Obsolete	TSOP	DIP, 0.6" (15.24mm) Row Spacing	48	0.020" (0.50mm)	Silver	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-301550-10 SOCKET ADAPTER SOIC TO 20PLCC Aries Electronics	3,680	-	RFQ	Datasheet	Correct-A-Chip® 301550	Bulk	Active	SOIC	PLCC	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-301550-20 SOCKET ADAPTER SOIC TO 20PLCC Aries Electronics	3,767	-	RFQ	Datasheet	Correct-A-Chip® 301550	Bulk	Active	SOIC	PLCC	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
08-301296-10 SOCKET ADAPTER SOIC TO TO-8 Aries Electronics	2,797	-	RFQ	Datasheet	Correct-A-Chip® 301296	Bulk	Active	SOIC	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
08-305479-10 SOCKET ADAPTER SOIC TO TO-8 Aries Electronics	1,684	-	RFQ	Datasheet	Correct-A-Chip® 305479	Bulk	Active	SOIC	JEDEC	8	0.050" (1.27mm)	-	Through Hole	Solder	-	Tin-Lead	-	FR4 Epoxy Glass
08-665000-00 SCK ADAPT 8P SOIC-W TO SOIC 0.6 Aries Electronics	3,029	-	RFQ	Datasheet	Correct-A-Chip® 665000	Bulk	Active	SOIC-W	SOIC	8	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
242-1281-19-0602J RECEPTACLE DIP SOCKET 42POS .6" 3M	1,094	-	RFQ	Datasheet	Textool™	Box	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	42	0.100" (2.54mm)	Gold	Through Hole	Wire Wrap	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
1107254-36 SOCKET ADAPTER DIP TO 36DIP 0.3 Aries Electronics	3,382	-	RFQ	Datasheet	Correct-A-Chip® 1107254	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	36	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Tin	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-35W000-11-RC SOCKET ADAPT SOIC-W TO 16DIP 0.3 Aries Electronics	4,629	-	RFQ	Datasheet	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
14-665000-00 SCK ADAPT 14P SOIC-W TO SOIC 0.6 Aries Electronics	3,999	-	RFQ	Datasheet	Correct-A-Chip® 665000	Bulk	Active	SOIC-W	SOIC	14	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
18-35W000-11-RC SOCKET ADAPT SOIC-W TO 18DIP 0.3 Aries Electronics	1,110	-	RFQ	Datasheet	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
18-665000-00 SCK ADAPT 18P SOIC-W TO SOIC 0.6 Aries Electronics	4,554	-	RFQ	Datasheet	Correct-A-Chip® 665000	Bulk	Active	SOIC-W	SOIC	18	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
08-350000-10-HT SOCKET ADAPTER SOIC TO 8DIP 0.3 Aries Electronics	2,439	-	RFQ	Datasheet	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	8	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
24-650000-10-P SOCKET ADAPTER SOIC TO 24DIP 0.6 Aries Electronics	1,535	-	RFQ	Datasheet	Correct-A-Chip® 650000	Bulk	Discontinued at Digi-Key	SOIC	DIP, 0.6" (15.24mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-35W000-11-RC SOCKET ADAPT SOIC-W TO 24DIP 0.3 Aries Electronics	3,359	-	RFQ	Datasheet	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
22-665000-00 SCK ADAPT 22P SOIC-W TO SOIC 0.6 Aries Electronics	3,188	-	RFQ	Datasheet	Correct-A-Chip® 665000	Bulk	Active	SOIC-W	SOIC	22	0.050" (1.27mm)	-	Surface Mount	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
20-350000-10-HT SOCKET ADAPTER SOIC TO 20DIP 0.3 Aries Electronics	4,866	-	RFQ	Datasheet	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)
28-35W000-11-RC SOCKET ADAPT SOIC-W TO 28DIP 0.3 Aries Electronics	1,767	-	RFQ	Datasheet	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	28	-	-	Through Hole	Solder	0.050" (1.27mm)	Gold	-	FR4 Epoxy Glass

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