BomKey Electronics - Socket Adapters - Sockets for ICs, Transistors - page 12 - Original source of goods - BomKey Electronics_Electronic Components Procurement Network

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Convert From (Adapter End)	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material
800-37-6-1 ADAPTER TE Connectivity Deutsch Connectors	1,202	-	RFQ	Datasheet	-	Bag	Active	-	-	-	-	-	-	-	-	-	-	-
95-132I25 SOCKET ADAPTER QFP TO 132PGA Aries Electronics	2,986	-	RFQ	Datasheet	Correct-A-Chip® 95-132I25	Bulk	Active	QFP	PGA	132	0.025" (0.64mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
96-160M65 SOCKET ADAPTER QFP TO 160PGA Aries Electronics	2,324	-	RFQ	Datasheet	Correct-A-Chip® 96-160M65	Bulk	Active	QFP	PGA	160	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
218-3341-09-0602J SOCKET ADAPTER 18DIP TO 18DIP 3M	1,663	-	RFQ	Datasheet	Textool™	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	DIP, 0.3" (7.62mm) Row Spacing	18	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
96-208M50 SOCKET ADAPTER QFP TO 208PGA Aries Electronics	4,341	-	RFQ	Datasheet	Correct-A-Chip® 96-208M50	Bulk	Active	QFP	PGA	208	0.020" (0.50mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
97-68340 SOCKET ADAPTER QFP TO 144PGA Aries Electronics	3,717	-	RFQ	Datasheet	Correct-A-Chip® 97-68340	Bulk	Active	QFP	PGA	144	0.026" (0.65mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin	-	FR4 Epoxy Glass
44-305263-20 SOCKET ADAPTER QFP TO 44PLCC Aries Electronics	4,563	-	RFQ	Datasheet	Correct-A-Chip® 305263	Bulk	Active	QFP	PLCC	44	0.024" (0.60mm)	-	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	-	FR4 Epoxy Glass
14-354W00-10 CONN ADAPTER 14PIN DIP TO SOWIC Aries Electronics	2,665	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	14	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
16-354W00-10 CONN ADAPTER 16PIN DIP TO SOWIC Aries Electronics	2,637	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	16	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
20-354W00-10 CONN ADAPTER 20PIN DIP TO SOWIC Aries Electronics	4,189	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	20	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
24-354W00-10 CONN ADAPTER 24PIN DIP TO SOWIC Aries Electronics	4,034	-	RFQ	Datasheet	Correct-A-Chip® 354W00	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	SOWIC	24	0.100" (2.54mm)	Gold	Through Hole	Solder	0.050" (1.27mm)	Tin-Lead	Polyamide (PA46), Nylon 4/6, Glass Filled	-
228-1290-09-0602J RECEPTACLE DIP SOCKET 28POS .4" 3M	2,605	-	RFQ	Datasheet	Textool™	Box	Discontinued at Digi-Key	DIP, 0.4" (10.16mm) Row Spacing	DIP, 0.4" (10.16mm) Row Spacing	28	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
228-1290-29-0602J RECEPTACLE DIP SOCKET 28POS .4" 3M	3,924	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.4" (10.16mm) Row Spacing	DIP, 0.4" (10.16mm) Row Spacing	28	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
242-1281-09-0602J RECEPTACLE DIP SOCKET 42POS .6" 3M	2,804	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	42	0.100" (2.54mm)	Gold	Through Hole	Solder	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
242-1293-29-0602J RECEPTACLE DIP SOCKET 42POS .6" 3M	1,248	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	42	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
248-1282-19-0602J RECEPTACLE DIP SOCKET 48POS .6" 3M	4,828	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.6" (15.24mm) Row Spacing	DIP, 0.6" (15.24mm) Row Spacing	48	0.100" (2.54mm)	Gold	Through Hole	Wire Wrap	0.100" (2.54mm)	Gold	Polysulfone (PSU), Glass Filled	-
264-1300-29-0602J RECEPTACLE DIP SOCKET 64POS .8" 3M	3,398	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.8" (20.32mm) Row Spacing	DIP, 0.8" (20.32mm) Row Spacing	64	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
290-1294-09-0602J RECEPTACLE DIP SOCKET 90POS .9" 3M	1,504	-	RFQ	Datasheet	Textool™	Box	Active	DIP, 0.9" (22.86mm) Row Spacing	DIP, 0.9" (22.86mm) Row Spacing	90	0.070" (1.78mm)	Gold	Through Hole	Solder	0.070" (1.78mm)	Gold	Polysulfone (PSU), Glass Filled	-
48-6645-18 SOCKET ADAPTER TQFP TO 48DIP 0.6 Aries Electronics	4,328	-	RFQ	Datasheet	Correct-A-Chip® 6645	Bulk	Active	TQFP	DIP, 0.6" (15.24mm) Row Spacing	48	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
18-350000-10-HT SOCKET ADAPTER SOIC TO 18DIP 0.3 Aries Electronics	4,127	-	RFQ	Datasheet	Correct-A-Chip® 350000	Bulk	Active	SOIC	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	Tin	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	Polyimide (PI)

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