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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    175-PGM16003-11

    175-PGM16003-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,444
    RFQ
    175-PGM16003-11

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    234-3034-01-0602

    234-3034-01-0602

    CONN ZIG-ZAG ZIF 34POS GOLD

    3M

    1,601
    RFQ
    234-3034-01-0602

    Datasheet

    Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 34 (1 x 34) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    42-6574-16

    42-6574-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,673
    RFQ
    42-6574-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3572-16

    42-3572-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    1,562
    RFQ
    42-3572-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    42-6571-16

    42-6571-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    4,794
    RFQ
    42-6571-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-560M33-001152

    550-10-560M33-001152

    BGA SOLDER TAIL

    Preci-Dip

    2,285
    RFQ
    550-10-560M33-001152

    Datasheet

    550 Bulk Active BGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    7100285426

    7100285426

    TEXTOOLBURN-IN GRID ZIP SOCKETS

    3M

    4,041
    RFQ
    7100285426

    Datasheet

    - Bulk Active - - - - - - - - - - - - - - -
    24-3552-18

    24-3552-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,353
    RFQ
    24-3552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    24-3553-18

    24-3553-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,643
    RFQ
    24-3553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    24-6551-18

    24-6551-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    1,156
    RFQ
    24-6551-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    24-6552-18

    24-6552-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,852
    RFQ
    24-6552-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    24-6553-18

    24-6553-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    1,793
    RFQ
    24-6553-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    24-3554-18

    24-3554-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    3,410
    RFQ
    24-3554-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    24-6554-18

    24-6554-18

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    2,672
    RFQ
    24-6554-18

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    558-10-500M30-001104

    558-10-500M30-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    2,131
    RFQ
    558-10-500M30-001104

    Datasheet

    558 Bulk Active BGA 500 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-83-600M35-001148

    514-83-600M35-001148

    CONN SOCKET BGA 600POS GOLD

    Preci-Dip

    1,640
    RFQ
    514-83-600M35-001148

    Datasheet

    514 Bulk Active BGA 600 (35 x 35) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-500M30-001105

    518-77-500M30-001105

    CONN SOCKET PGA 500POS GOLD

    Preci-Dip

    4,804
    RFQ
    518-77-500M30-001105

    Datasheet

    518 Bulk Active PGA 500 (30 x 30) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    558-10-504M29-001104

    558-10-504M29-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    2,104
    RFQ
    558-10-504M29-001104

    Datasheet

    558 Bulk Active BGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    518-77-504M29-001105

    518-77-504M29-001105

    CONN SOCKET PGA 504POS GOLD

    Preci-Dip

    3,107
    RFQ
    518-77-504M29-001105

    Datasheet

    518 Bulk Active PGA 504 (29 x 29) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    108-PLS12024-12

    108-PLS12024-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,222
    RFQ
    108-PLS12024-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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