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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-PRS16018-12

    30-PRS16018-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,779
    RFQ
    30-PRS16018-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PRS16020-12

    30-PRS16020-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,543
    RFQ
    30-PRS16020-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PRS16022-12

    30-PRS16022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,377
    RFQ
    30-PRS16022-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    108-PLS12005-12

    108-PLS12005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,258
    RFQ
    108-PLS12005-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    518-77-432M31-001106

    518-77-432M31-001106

    CONN SOCKET PGA 432POS GOLD

    Preci-Dip

    4,158
    RFQ
    518-77-432M31-001106

    Datasheet

    518 Bulk Active PGA 432 (31 x 31) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    48-3554-16

    48-3554-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    1,016
    RFQ
    48-3554-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6554-16

    48-6554-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    3,608
    RFQ
    48-6554-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    209-PGM17020-10H

    209-PGM17020-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    1,990
    RFQ
    209-PGM17020-10H

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    550-10-500M30-001152

    550-10-500M30-001152

    BGA SOLDER TAIL

    Preci-Dip

    2,128
    RFQ
    550-10-500M30-001152

    Datasheet

    550 Bulk Active BGA 500 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    15-PRS15068-12

    15-PRS15068-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,669
    RFQ
    15-PRS15068-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    550-10-504M29-001152

    550-10-504M29-001152

    BGA SOLDER TAIL

    Preci-Dip

    2,962
    RFQ
    550-10-504M29-001152

    Datasheet

    550 Bulk Active BGA 504 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    80-PRS15072-12

    80-PRS15072-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,802
    RFQ
    80-PRS15072-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    558-10-478M26-131101

    558-10-478M26-131101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    4,126
    RFQ
    558-10-478M26-131101

    Datasheet

    558 Bulk Active PGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    18-PLS15071-12

    18-PLS15071-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,223
    RFQ
    18-PLS15071-12

    Datasheet

    PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    18-PRS15071-12

    18-PRS15071-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,740
    RFQ
    18-PRS15071-12

    Datasheet

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    558-10-480M29-001101

    558-10-480M29-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    3,032
    RFQ
    558-10-480M29-001101

    Datasheet

    558 Bulk Active PGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    44-3570-16

    44-3570-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    1,940
    RFQ
    44-3570-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    44-3571-16

    44-3571-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    3,603
    RFQ
    44-3571-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    44-3572-16

    44-3572-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    3,195
    RFQ
    44-3572-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    44-3574-16

    44-3574-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,166
    RFQ
    44-3574-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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