BomKey Electronics!
    BomKey Electronics+852-69415941

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

    Reset All
    Apply All
    Result
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    210-88-628-41-001000

    210-88-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,293
    RFQ
    210-88-628-41-001000

    Datasheet

    - Tube Active - - - - - - - - - - - - - - -
    110-88-628-41-001000

    110-88-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,597
    RFQ
    110-88-628-41-001000

    Datasheet

    - Tube Active - - - - - - - - - - - - - - -
    110-33-308-41-530000

    110-33-308-41-530000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,105
    RFQ
    110-33-308-41-530000

    Datasheet

    110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-314-41-001000

    110-83-314-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,735
    RFQ
    110-83-314-41-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-83-314-41-001000

    210-83-314-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,361
    RFQ
    210-83-314-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
    32-6574-16

    32-6574-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,602
    RFQ
    32-6574-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3551-16

    28-3551-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    3,926
    RFQ
    28-3551-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3553-16

    28-3553-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    2,826
    RFQ
    28-3553-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6551-16

    28-6551-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    1,353
    RFQ
    28-6551-16

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-352M26-001101

    558-10-352M26-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    1,288
    RFQ
    558-10-352M26-001101

    Datasheet

    558 Bulk Active PGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    110-83-316-41-001000

    110-83-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,383
    RFQ
    110-83-316-41-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-83-316-41-001000

    210-83-316-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,048
    RFQ
    210-83-316-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
    110-83-320-41-001000

    110-83-320-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    1,092
    RFQ
    110-83-320-41-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-83-320-41-001000

    210-83-320-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,319
    RFQ
    210-83-320-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
    514-83-400M20-000148

    514-83-400M20-000148

    CONN SOCKET BGA 400POS GOLD

    Preci-Dip

    3,318
    RFQ
    514-83-400M20-000148

    Datasheet

    514 Bulk Active BGA 400 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-88-640-41-001000

    110-88-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,635
    RFQ
    110-88-640-41-001000

    Datasheet

    - Tube Active - - - - - - - - - - - - - - -
    210-88-640-41-001000

    210-88-640-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    4,219
    RFQ
    210-88-640-41-001000

    Datasheet

    - Tube Active - - - - - - - - - - - - - - -
    210-83-632-41-101000

    210-83-632-41-101000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,190
    RFQ
    210-83-632-41-101000

    Datasheet

    210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3570-16

    32-3570-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    1,293
    RFQ
    32-3570-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    32-3571-16

    32-3571-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,897
    RFQ
    32-3571-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 882883884885886887888889...955Next»
    Contact Us Get more product information!
    BomKey Electronics

    Home

    BomKey Electronics

    Products

    BomKey Electronics

    Phone

    BomKey Electronics

    User

    Low price every day, worry-free selection
    Low price every day, worry-free selection
    Genuine licensed goods, exquisite service
    Genuine licensed goods, exquisite service
    Multi-warehouse direct delivery, fast delivery
    Multi-warehouse direct delivery, fast delivery
    Complete range for easy shopping
    Complete range for easy shopping
    Copyright © 2025 Bomkey Electronics. All rights reserved