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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APA-648-G-Q

    APA-648-G-Q

    ADAPTER PLUG

    Samtec Inc.

    4,294
    RFQ
    APA-648-G-Q

    Datasheet

    APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    514-87-420M26-001148

    514-87-420M26-001148

    CONN SOCKET BGA 420POS GOLD

    Preci-Dip

    2,620
    RFQ
    514-87-420M26-001148

    Datasheet

    514 Bulk Active BGA 420 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    558-10-272M20-001104

    558-10-272M20-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    3,217
    RFQ
    558-10-272M20-001104

    Datasheet

    558 Bulk Active BGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-1438-G-R

    APH-1438-G-R

    APH-1438-G-R

    Samtec Inc.

    3,226
    RFQ
    APH-1438-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0538-G-R

    APH-0538-G-R

    APH-0538-G-R

    Samtec Inc.

    1,479
    RFQ
    APH-0538-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1538-G-R

    APH-1538-G-R

    APH-1538-G-R

    Samtec Inc.

    4,718
    RFQ
    APH-1538-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0638-G-R

    APH-0638-G-R

    APH-0638-G-R

    Samtec Inc.

    2,153
    RFQ
    APH-0638-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1638-G-R

    APH-1638-G-R

    APH-1638-G-R

    Samtec Inc.

    3,611
    RFQ
    APH-1638-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1138-G-R

    APH-1138-G-R

    APH-1138-G-R

    Samtec Inc.

    2,595
    RFQ
    APH-1138-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0338-G-R

    APH-0338-G-R

    APH-0338-G-R

    Samtec Inc.

    1,144
    RFQ
    APH-0338-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    518-77-272M20-001105

    518-77-272M20-001105

    CONN SOCKET PGA 272POS GOLD

    Preci-Dip

    4,936
    RFQ
    518-77-272M20-001105

    Datasheet

    518 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    24-6572-16

    24-6572-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    4,250
    RFQ
    24-6572-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    24-6574-16

    24-6574-16

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    1,440
    RFQ
    24-6574-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    558-10-292M20-001101

    558-10-292M20-001101

    PGA SOLDER TAIL 1.27MM

    Preci-Dip

    1,453
    RFQ
    558-10-292M20-001101

    Datasheet

    558 Bulk Active PGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-1340-G-H

    APH-1340-G-H

    APH-1340-G-H

    Samtec Inc.

    1,945
    RFQ
    APH-1340-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1840-G-H

    APH-1840-G-H

    APH-1840-G-H

    Samtec Inc.

    4,365
    RFQ
    APH-1840-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0940-G-H

    APH-0940-G-H

    APH-0940-G-H

    Samtec Inc.

    2,993
    RFQ
    APH-0940-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1540-G-H

    APH-1540-G-H

    APH-1540-G-H

    Samtec Inc.

    4,869
    RFQ
    APH-1540-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1040-G-H

    APH-1040-G-H

    APH-1040-G-H

    Samtec Inc.

    2,365
    RFQ
    APH-1040-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1740-G-H

    APH-1740-G-H

    APH-1740-G-H

    Samtec Inc.

    4,219
    RFQ
    APH-1740-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
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