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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1328-G-H

    APH-1328-G-H

    APH-1328-G-H

    Samtec Inc.

    4,132
    RFQ
    APH-1328-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0228-G-H

    APH-0228-G-H

    APH-0228-G-H

    Samtec Inc.

    4,967
    RFQ
    APH-0228-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    1437522-4

    1437522-4

    CONN SOCKET PGA 321POS GOLD

    TE Connectivity AMP Connectors

    3,439
    RFQ
    1437522-4

    Datasheet

    - Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Thermoplastic, Polyester -55°C ~ 105°C
    APH-0534-G-R

    APH-0534-G-R

    APH-0534-G-R

    Samtec Inc.

    1,295
    RFQ
    APH-0534-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0934-G-R

    APH-0934-G-R

    APH-0934-G-R

    Samtec Inc.

    3,161
    RFQ
    APH-0934-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1034-G-R

    APH-1034-G-R

    APH-1034-G-R

    Samtec Inc.

    2,918
    RFQ
    APH-1034-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0734-G-R

    APH-0734-G-R

    APH-0734-G-R

    Samtec Inc.

    4,106
    RFQ
    APH-0734-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1334-G-R

    APH-1334-G-R

    APH-1334-G-R

    Samtec Inc.

    2,779
    RFQ
    APH-1334-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0434-G-R

    APH-0434-G-R

    APH-0434-G-R

    Samtec Inc.

    4,575
    RFQ
    APH-0434-G-R

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    116-43-950-61-008000

    116-43-950-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,540
    RFQ
    116-43-950-61-008000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-61-008000

    116-93-950-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,973
    RFQ
    116-93-950-61-008000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-61-001000

    116-93-652-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,249
    RFQ
    116-93-652-61-001000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-281-19-001112

    614-87-281-19-001112

    CONN SOCKET PGA 281POS GOLD

    Preci-Dip

    4,324
    RFQ
    614-87-281-19-001112

    Datasheet

    614 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-83-279-19-081117

    514-83-279-19-081117

    CONN SOCKET PGA 279POS GOLD

    Preci-Dip

    2,873
    RFQ
    514-83-279-19-081117

    Datasheet

    514 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    44-3570-11

    44-3570-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    4,395
    RFQ
    44-3570-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3574-11

    44-3574-11

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,354
    RFQ
    44-3574-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6570-11

    44-6570-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    3,588
    RFQ
    44-6570-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6572-11

    44-6572-11

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    3,877
    RFQ
    44-6572-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6573-11

    44-6573-11

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    3,624
    RFQ
    44-6573-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6574-11

    44-6574-11

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    1,486
    RFQ
    44-6574-11

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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