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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-0634-G-T

    APH-0634-G-T

    APH-0634-G-T

    Samtec Inc.

    2,906
    RFQ
    APH-0634-G-T

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    116-43-650-61-008000

    116-43-650-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,782
    RFQ
    116-43-650-61-008000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-650-61-008000

    116-93-650-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,192
    RFQ
    116-93-650-61-008000

    Datasheet

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-668-61-005000

    117-93-668-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,616
    RFQ
    117-93-668-61-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-952-61-003000

    116-43-952-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,504
    RFQ
    116-43-952-61-003000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-952-61-003000

    116-93-952-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    1,671
    RFQ
    116-93-952-61-003000

    Datasheet

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-87-321-17-101147

    546-87-321-17-101147

    CONN SOCKET PGA 321POS GOLD

    Preci-Dip

    2,845
    RFQ
    546-87-321-17-101147

    Datasheet

    546 Bulk Active PGA 321 (17 x 17) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    546-87-321-19-121147

    546-87-321-19-121147

    CONN SOCKET PGA 321POS GOLD

    Preci-Dip

    4,214
    RFQ
    546-87-321-19-121147

    Datasheet

    546 Bulk Active PGA 321 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0526-G-H

    APH-0526-G-H

    APH-0526-G-H

    Samtec Inc.

    3,533
    RFQ
    APH-0526-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1926-G-H

    APH-1926-G-H

    APH-1926-G-H

    Samtec Inc.

    4,023
    RFQ
    APH-1926-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1526-G-H

    APH-1526-G-H

    APH-1526-G-H

    Samtec Inc.

    4,518
    RFQ
    APH-1526-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0826-G-H

    APH-0826-G-H

    APH-0826-G-H

    Samtec Inc.

    1,520
    RFQ
    APH-0826-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1826-G-H

    APH-1826-G-H

    APH-1826-G-H

    Samtec Inc.

    1,047
    RFQ
    APH-1826-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1326-G-H

    APH-1326-G-H

    APH-1326-G-H

    Samtec Inc.

    3,678
    RFQ
    APH-1326-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-1226-G-H

    APH-1226-G-H

    APH-1226-G-H

    Samtec Inc.

    2,246
    RFQ
    APH-1226-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0226-G-H

    APH-0226-G-H

    APH-0226-G-H

    Samtec Inc.

    3,198
    RFQ
    APH-0226-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    APH-0326-G-H

    APH-0326-G-H

    APH-0326-G-H

    Samtec Inc.

    4,252
    RFQ
    APH-0326-G-H

    Datasheet

    * - Active - - - - - - - - - - - - - - -
    517-83-419-19-111111

    517-83-419-19-111111

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    2,666
    RFQ
    517-83-419-19-111111

    Datasheet

    517 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6556-31

    48-6556-31

    UNIV TEST SOCKET RECEPT 6556

    Aries Electronics

    3,573
    RFQ
    48-6556-31

    Datasheet

    6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled 150°C
    24-6556-40

    24-6556-40

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,869
    RFQ
    24-6556-40

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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