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    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature

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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    XR2A-2811-N

    XR2A-2811-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    4,023
    RFQ
    XR2A-2811-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2471-N

    XR2A-2471-N

    IC CONNECTOR

    Omron Electronics Inc-EMC Div

    2,543
    RFQ
    XR2A-2471-N

    Datasheet

    * Bulk Active - - - - - - - - - - - - - - -
    XR2A-2401-N

    XR2A-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    3,049
    RFQ
    XR2A-2401-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-3211-N

    XR2A-3211-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    2,124
    RFQ
    XR2A-3211-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2025

    XR2A-2025

    CONN IC DIP SOCKET 20POS GOLD

    Omron Electronics Inc-EMC Div

    3,112
    RFQ
    XR2A-2025

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-2801-N

    XR2A-2801-N

    CONN IC DIP SOCKET 28POS GOLD

    Omron Electronics Inc-EMC Div

    4,383
    RFQ
    XR2A-2801-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2A-3221-N

    XR2A-3221-N

    CONN IC DIP SOCKET 32POS GOLD

    Omron Electronics Inc-EMC Div

    1,836
    RFQ
    XR2A-3221-N

    Datasheet

    XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2C-3215

    XR2C-3215

    CONN SOCKET SIP 32POS GOLD

    Omron Electronics Inc-EMC Div

    1,840
    RFQ
    XR2C-3215

    Datasheet

    XR2 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2T-2401-N

    XR2T-2401-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    2,817
    RFQ
    XR2T-2401-N

    Datasheet

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    XR2T-2411-N

    XR2T-2411-N

    CONN IC DIP SOCKET 24POS GOLD

    Omron Electronics Inc-EMC Div

    1,844
    RFQ
    XR2T-2411-N

    Datasheet

    XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
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